ESD Microelectronics Device and System Testing

ETS’ Microelectronics Test Lab provides semiconductor and electronics design firms worldwide with testing and evaluation support to facilitate new product introduction and reliability evaluation. We actively serve a range of semiconductor and electronics companies worldwide, and the fact that ETS designs and builds the equipment used in that testing gives us an extensive base of knowledge for this analysis.


Susceptibility Testing of Devices, Sub-Assemblies and Products – Evaluates the electrostatic discharge (ESD) susceptibility of electronic components, systems, and non-electronic devices using either Human Body Model (HBM), Machine Model (MM), Human Metal Model (HMM) or Charged Device Model (CDM) discharge networks.

ESD Simulation (Components): Performed using an HBM at voltages from <±5 to 8,000 Volts (V) or an MM up to ±1,000V. Single or multiple discharges are applied to defined pin combinations in stepped voltage increments until deterioration or failure occurs. CDM testing is also available up to 1,000V.

ESD Simulation (Systems): ESD simulators determine likely failure points and voltage susceptibility levels of assemblies and complete systems. Simulators can be configured with either HBM or HMM networks up to ±30kV and MM or CDM networks up to ±6kV.


ESD simulators can be configured with the following discharge networks to apply ESD pulses to the Device Under Test (DUT):

  • Human Body Model (HBM) per Mil Std 883 and ANSI/ESDA/JEDEC JS001;
  • Machine Model (MM) per ANSI/ESDA S5.2;
  • Human Metal Model (HMM) per IEC61000-4-2; or
  • IEEE, JEDEC, EIA plus other similar industry, military and international standards.


Charge and access cards can be charged by cardholder movement. When swiped or inserted, the card and/or the person using it can discharge to the device to which it is being inserted. The resulting discharge has the potential to disrupt or damage the device.


ETS has a comprehensive testing protocol to evaluate the ESD characteristics of these cards. Measurements include the following:

  • Card resistance characteristics;
  • Ability to become charged when rubbed with different materials and by the movement of the card holder;
  • Application of voltages up to 10,000V on the card and measuring discharge current (Ip) into a test target, followed by calculation of the resulting discharge energy (E) using the ETS Test Suite Manager Energy Calculation Program; and
  • Performing threshold tests using an actual device.
ETS ESD Simulation Testing of Offboard Device Module
Electro-Tech Systems, Inc.